Qualcomm is hiring intern in our Hsinchu office now! We plan to hire 30+ students in Jan., 2019 and openings are listed below ：

• Intern, Product Test Engineering (E1967236)
• Intern, Characterization Engineer (E1967391)
• Intern, Finger Print Process Engineer (E1967392)
• Intern, Test Engineer (E1967393)
• Intern, Supplier Quality Engineering (E1967394)
• Intern, Reliability Engineering (E1967395)
• Intern, Thermal Engineer (E1967396)
• Intern, Test Circuit Design Engineer (E1967425)
• Intern, RMA Engineer (E1967467)
• Intern, Device Data Analysis Engineer (E1967468)
• Intern, Spice Model Engineer (E1967470)
• Intern, Product & Test Engineering (E1967511)
• Intern, Reliability Engineer (E1967513)
• Intern, Planner (N1967390)

Requirements :

1. Candidates must be students. 
2. Target students are from Master of Electrical Engineering, Physics, Material Science, Chemical Engineering, Industrial Engineering.
3. Commitment of at least 3 month internship working not less than 20 hours per week. 
4. Please submit your English resume and transcript to TaiwanCampus@qti.qualcomm.com. 

Feel free to contact us at TaiwanCampus@qti.qualcomm.com if any question.