Chia-Pyng Lee

Professor

Office Location:E2-506
Phone:886-2-2737-6623
Fax:886-2-2737-6644
E-mail:cplee@mail.ntust.edu.tw
Web pages: http://homepage.ntust.edu.tw/cl/

Education & Honors:

Ph.D: University of Minnesota, 1986

Honors: 1990~2001, National Science Council (Taiwan, R.O.C.) Annual Research Award
2006, Outstanding Research and Innovation Award of NTUST
2007, Excellent Research and Innovation Award of NTUST

Experience: Professor Lee served as an IC process engineer at Cray Research in 1986-1988. He had a patent:"Low temperature growth of silicon epitaxy".

It’s only about forty years since 1958, the beginning of the integrated-circuit (IC) era , the sales of electronic products have increased by about thirty times. The main impetuses of such phenomenal market growth are the intrinsic pervasiveness of electronic products and the continued technological breakthroughs in IC. The popularization of internet and personal computer is the trend of future. All the industrial countries have put into lots of effort on the establishment of information super-highway in order to increase the capability competition.

After graduation from University of Minnesota, Professor Lee served as an IC process engineer at Cray Research in 1986-1988. During this industrial employment, he found that many IC processing technologies such as chemical vapor deposition, oxidation, diffusion and plasma etching are easily picked up by chemical engineers. Of course, the early research and development of technologies were done by electronic engineers. However the shrinkage of the design rule put tremendous pressure on the process development. Professor Lee believed that this is about the time for chemical engineers to put more effort into the R & D. Therefore, Professor Lee's research interests are closely related to the IC processing. Due to the dramatic development in energy and biotechnology, Professor Lee has also applied the IC fabrication techniques on fuel cells and biosensors in recent years.

1. Yu-Lin Kuo, Chiapyng Lee, Jing-Cheng Lin, Chao-Hsien Peng, Li-Chien Chen, Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang, Brian J. Daniels, Cheng-Lin Huang, and Chih-Huang Lai, 2003, Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization, Electrochemical and Solid-State Letters, Vol. 6, No. 9, P.C123-C125.(SCI)
2. Yu-Lin Kuo, Hsin-Hung Lee, Chiapyng Lee, Jing-Cheng Lin, Shau-Lin Shue, Mong-Song Liang, and Brian J. Daniels, 2004,Diffusion of Copper in Titanium Zirconium Nitride Thin Films, Electrochemical and Solid-State Letters, Vol. 7, No. 3, P.C35-C37.(SCI)
3. Chiapyng Lee and Hsin-Hung Lee, 2005,A Potential Novel Two Step MOCVD of Copper Seed Layers, Electrochemical and Solid-State Letters, Vol. 8, No. 1, P.G5-G7.(SCI) .
4. Hsin-Hung Lee, Chiapyng Lee, Yu-Lin Kuo, Yee-Wen Yen, 2006, A Novel Two-Step MOCVD for Producing Thin Copper Films with A Mixture of Ethyl Alcohol and Water as the Additive, Thin Solid Films, Vol. 498, P. 43-49.(SCI)
5. Yu-Lin Kuo, Chiapyng Lee, Gene Chen, Kou-Liang Liu, and Yee-Wen Yen, 2007, Electro-Enhanced Metalorganic Chemical Vapor Deposition of Copper Films, Electrochemical and Solid-State Letters, Vol. 10, No. 5, D51-D54.(SCI)

Last Updated: 2008.01.09