時間

項目

說明

6/23前

摘要截稿

請上傳至www.impact.org.tw投稿，英文400-500字【F】

7/17前

入選通知

發信通知摘要入選者

8/14前

議程公告

將於IMPACT網站公告論文所屬場次，參賽者均須報名繳費

8/25前

全文截稿

請上傳至www.impact.org.tw，英文全文4頁【F】

IEEE版權

提供IEEE Form，論文可收錄至IEEE Xplore【F】

9/30前

得獎通知

發信通知得獎者

10/22-10/25

論文發表
(TPCA Show & IMPACT)

書面：於TPCA Show《PCB優秀論文主題區》海報呈現【F】

口頭：於IMPACT Conference英文口語發表【F】

有入圍但無得獎者，於IMPACT Conference進行論文發表(配合大會通知之Oral或Poster安排)

待訂

頒獎典禮

請得獎者出席TPCA公開活動進行領獎

代碼

領域

B1

Advanced and Green Materials and Process先進與綠色製造材料製程

Green materials(LF、HF、 Energy saving、 Recycling and Reducing etc.) , Green process and manufacturing , Low carbon materials , High frequency and speed materials, Millimeter-wave materials(Low Dk/Df) , Low CTE and low water absorption materials, Thermal dissipation materials, Photonics waveguide materials, Photo and non-photo dielectric materials for high density application, Advanced Substrate materials and process.

B2

Test, Quality, AOI, Inspection and Reliability測試、品質、自動光學檢測、可靠度技術

Feature Testing and Verification, Inspection(AOI, Non-destructive testing), Electrical evaluation, Structure integrity, Reliability testing and verification, Failure mechanism analysis.

B3

HDI, IC Substrate and FPC Technology高密度互連技術、IC載板及軟板

SAP and m-SAP process(Fine pitch line), Build-up board, Micro-vias and copper plating process, Multilayer core and coreless , Embedded devices, Advanced flex and rigid-flex, High speed and high frequency circuitry, High power and thermal dissipation substrate technology.

B4

Smart Manufacturing and Automation 智慧製造及自動化相關

Mechatronics, Robotics, Control systems, Tele-robotics, Human computer(robot) interaction, Modeling and simulation techniques, Intelligent control and manufacturing, Neuro-control, Fuzzy control and their applications, Automatic control system, Process integration .

獎項

名額

獲獎內容

金獎

1名

10萬元 (含6萬獎金、至多4萬海外參訪補助)、獎座、獎狀

銀獎

1名

8萬元 (含4萬獎金、至多4萬海外參訪補助)、獎座、獎狀

銅獎

1名

2萬元、獎座、獎狀